Rigid PCB Production Capacity
| Rigid PCB | | SERIAL | ITEM | TECHNICAL DATA | | 1 | Types of Products | HDL Multilayer PCB, Buried/Blind Via Board, High Frequency Board, Aluminum Base Board Flex-Rigid PCB，FPC, Teflon Board, and HDI | | 2 | Layers | 2－26(layers) | | 3 | Max Board Size | 450x660mm 18" x 26" | | 4 | Min Board Thickness | 4（layers）0.40mm 16mil | | 6（layers）0.80mm 32mil | | 8（layers）1.00mm 40mil | | 10（layers）1.20mm 48mil | | 5 | Copper Clad(Max.) | 6 oz(outer)/4 oz(inner) | | 6 | Min line Width/space | 0.075mm 3mil | | 7 | Drill Size Mechanical (min) | 0.20mm 8mil | | 8 | Drill Size Laser(min) | 0.10mm 4mil | | 9 | PTH Wall Thickness | 0.020mm 0.8mil | | 10 | PTH dia tolerance | ±0.075mm ±3mil | | 11 | NPTH hole dia tolerance | ±0.05mm ±2mil | | 12 | Hole Position Deviation | ±0.05mm ±2mil | | 13 | Outline Tolerance | ±0.10mm ±4mil | | 14 | S/M Pitch | 0.08mm 3mil | | 15 | Insulation Resistance | 1E+12Ω(Normal) | | 16 | Test Voltage | 50~300V | | 17 | Aspect ratio | 8：1 | | 18 | Thermal Shock | 3x10Sec@288 ℃ | | 19 | Warp and Twist | ≤0.7% | | 20 | Current breakdown | 10A | | 21 | Electric Strength | ＞1.3KV/mm | | 18 | Peel Strength | 1.4N/mm | | 23 | Solder Mask Abrasion | ≥6H | | 24 | Flammability | 94V-0 | | 25 | Impedance Control | +/-10%(Differential) | | 26 | Buried Via | Yes | | 27 | Blind Via | Yes | | 28 | HDI | 2+N+2 4mil Via hole | | 29 | Surface Finished | ENIG,ImAg,ImSn,OSP,HASL | | 30 | Materials | FR-4 1, F4B ,CEM-1,CEM-3 Getek,Rogers,Aluminum Board, High TG |
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