| Flex/Rigid-Flex PCB |
| 1 | Layers | 1 to 4 layers(Flexible Board) |
| 2 to 12 layers(Rigid_Flex Board) |
| 2 | Normal Base Materials | Kapton,PI,PET for Flex |
| FR4 for Rigid |
| 3 | Normal Base Film Thickness | 12.5um to 50um for Flex |
| 0.1mm to 3.2mm for Rigid |
| 4 | Normal Coverlay Thickness | 12un to 25um |
| 5 | Normal Adhesive Thickness | 12un to 35um |
| 6 | Base Copper Thickness | 1/2oz. To 1 oz.(RA/ED Copper) |
| 7 | Stiffener Materials | PI,PET,FR4,SUS |
| 8 | Min.Finished Thicness | 0.075mm/0.025"(Single Sided) |
| 0.13mm/0.005"(Double Sided |
| 0.31mm/0.012"(4Layers) |
| 9 | Max.Panel Size | 250mmx400mm/9.8"x15.7" |
| 10 | Min.Drill Diameter | 0.15mm/0.006" |
| 11 | Blind or Buried Vias | Yes for Rigid_Flex Board |
| 12 | Min.Line width/spacing | 0.05mm/0.002" |
| 13 | Min.Bonding Pitch | 0.10mm/0.004"(Center to Center) |
| 14 | Min.SMT Pitch | 0.40mm/0.016"(Center to Center) |
| 15 | Surface Finishing | Plated soft Gold over Nickel for Ultrassonic Bonding |
| Plated soft Gold over Nickel for Thermalsonicc Bonding |
| Plated selective hard Gold over Nickel for commector |
| ENIG (Electroless Nickel &lmmersion Gold |
| Hot Air Solder Leveling |
| lmmersion Tin |
| Silver lnk or Carbon lnk Printing |
| Organic Soldersbility Preservative (ENTEK) |
| 16 | Solder Mask | Liquid Photoimageble Solder Mask |
| 17 | Outline Fabrication | Precision Punching |
| CNC Routing for Rigid part only |
| CNC V-scoring for Rigid part only |
| 18 | General Tolerance | Min.Hole Diameter Tolerance ±0.05mm |
| Min.Hole Position Tolerance ±0.05mm |
| Min.Pattem Registraion Tolerance ±0.05MM |
| Min. Soler Mask Registraion Tolerance ±0.075mm |
| 19 | Genntal Capabiliti | Min.Annular ring 0.025mm |
| Min.Solder Mask Bridge(LPI) 0.1mm |
| Plated Gold Thickness 0.025um~3um |
| Immersion Gold Thivkness 0.025um~0.1um |
| Twist and Warp : 1% |
| 20 | E-Testing | Volatge :24V~3000V |
| Continuity :5-100ohms |
| Flying Probe E-tester and AOI available |
